TSMC (NYSE:TSM) announced new chipmaking and advanced packaging technologies, including major CoWoS updates and fresh A13, A12 and N2U process nodes. The company presented these technologies at its 2026 Taiwan Technology Symposium, focusing on AI and high performance computing needs. Taiwan Semiconductor Manufacturing comes into this technology reveal with a share price of $401.62 and very large 3 year and 1 year returns, while the 5 year figure is also high. The stock is up 9.7% over the...