Reuters11h agoneutral
Lam Research opens Austria lab to advance chip packaging, cut costsLam Research has opened a research lab in Salzburg, Austria, to advance a chip packaging technology that promises to increase chip density and cut costs, as the company looks to capitalize on surging AI demand for processors. The U.S. chipmaking tools supplier said on Wednesday that the Salzburg facility will focus on panel-level packaging, which replaces the semiconductor industry's traditional circular silicon wafers with square panels. Square panels can eliminate the dead space, allowing chipmakers to produce more chips per surface at a lower cost per unit — a crucial advantage as AI drives chip shortages.
