Applied Materials (NasdaqGS:AMAT) has entered a new advanced packaging technology partnership with Broadcom. Broadcom is joining Applied’s EPIC platform to work on advanced chip packaging for next-generation AI systems. The collaboration expands Applied’s network of industry and academic partners focused on AI hardware R&D. Applied Materials sits at the center of the semiconductor equipment and materials market, providing tools that chipmakers use to build and package devices. As AI...