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The entire photonics value chain mapped end-to-end, from MOCVD reactors to AI-cluster optical switches. Front-end fabrication (layers 1-4) covers equipment, photonic ICs, discrete components, and substrates. Back-end fabrication (layers 5-8) covers transceivers, packaging, test, and systems. Each layer flags one "top pick" (★) per The Analyst's framework. Companion to the $LYTE ETF coverage — same universe, different lens: the ETF wraps the thesis, this watchlist breaks it down by capability layer.
source: x-the-analyst-2026-05-21