
Recent developments in the AI chip market highlight a significant shift towards advanced chip packaging technologies. According to BCC Research, this market is expected to grow substantially, from $38.6 billion in 2024 to $87.6 billion by 2030, driven by increasing demand for AI and high-performance computing applications. This growth is largely influenced by the need for improved data throughput, reduced latency, and greater interconnect density, surpassing what traditional packaging can...

























