We use Google Analytics to count anonymous page views and understand which content gets read. No ads, no profiles. Decline keeps you on cookieless mode. Details.
Microchip Technology Incorporated
Information Technology · Semiconductors
Broad-line embedded silicon supplier mid-cycle through an inventory correction. 03B, down ~42% Y/Y from FY24 peak; non-GAAP GM compressed to ~58% from ~68% peak as under-utilization charges hit the P&L. Channel inventory at distributors elevated through 2026, with mgmt 9-point recovery plan + Tempe fab consolidation targeting $90M annual savings.
- Cycle-bottom optionality: revenue down ~42% peak-to-trough, GM compression mechanical (under-util), normalizes on volume return
- Sticky ~125k customer base, MCU + analog design wins multi-year sockets in industrial + auto
- Microsemi FPGA leg = aero/defense exposure ($LMT $RTX $NOC programs), counter-cyclical to industrial
- Tempe fab shutdown + structural opex cuts → operating leverage when revenue recovers
- ~5% dividend yield (declared $0.455/qtr) signals cash-flow durability through trough
- Inventory correction longer than peers ($TXN, $ADI, $ON) - Q4 FY26 guide implies further down before flat
- Auto end-market deceleration as EV unit growth slows; industrial PMI still sub-50 in EU/US
- China local MCU competition ($GIGA, others) pressuring low-end 8/16-bit pricing
- High net debt (~$5B) carried into trough complicates buyback/M&A re-leverage
- GM recovery depends on factory loadings - re-loading Tempe canceled, structural ceiling reset
No key levels recorded for this ticker.