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BE Semiconductor Industries (BESI) on Thursday said its quarterly orders grew significantly in the first-quarter, helped by growth across ‌all its markets and particularly strong demand for hybrid bonding. Investors ‌are banking on growing orders for Besi's hybrid bonding solutions, a chip technology allowing two ​chips to be bonded directly on top of each other, citing its first-mover advantage amid a surge in demand for AI-enabling technology. Besi said its order bookings, an important indicator of future growth, jumped 104.5% to 269.7 million ‌euros ($315.5 million) in the first ⁠quarter, compared with 131.9 million euros last year.

Lam Research Corporation (NASDAQ:LRCX) is one of the best forever stocks to buy now. On March 12, Reuters reported that Lam Research Corp (NASDAQ:LRCX) is one of the suitors eyeing a potential deal to acquire BE Semiconductor Industries. The report also indicated that Besi has already engaged the services of investment bank Morgan Stanley, as […]

Lam Research (NasdaqGS:LRCX) has reportedly held takeover talks with BE Semiconductor Industries (BESI). The discussions point to potential M&A activity that could affect the semiconductor equipment supply chain. The move focuses attention on advanced packaging tools and Lam's position across key chipmaking workflows. Lam Research is a major supplier of wafer fabrication equipment to logic, memory, and foundry customers worldwide, and BESI focuses on advanced packaging and assembly...

BE Semiconductor Industries has attracted takeover interest as its chip-packaging technology becomes increasingly strategic for semiconductor equipment manufacturers, according to three people familiar with the matter. The Amsterdam-listed chip equipment maker, known ‌as Besi, which has a market value of 14 billion euros ($16.20 billion), has been working with investment bank Morgan Stanley to evaluate ‌the approaches, two of the people said, requesting anonymity as the discussions are confidential. U.S. chip-equipment maker Lam Research is among the suitors that have held discussions with the Dutch company, ​one of the people said.

Leading memory chipmakers such as Samsung and SK Hynix are discussing new thickness limits for high bandwidth memory packaging. These talks could postpone the rollout of hybrid bonding in HBM production, a technology closely tied to BE Semiconductor Industries' tools. Comments from ENXTAM:BESI's CEO and ongoing industry body discussions point to uncertainty around when and how broadly hybrid bonding will be adopted. For you as an investor looking at ENXTAM:BESI, this matters because hybrid...

Report suggests thicker HBM designs could delay hybrid bonding adoption

The European stock markets closed lower in Friday trading as war in the Middle East has caused oil p