QuantAbundanciaAbundance, Quantified.

News

High-signal headlines only - macro events, earnings, M&A, regulatory. Listicles and analyst clickbait filtered out by default. Refreshed hourly.

20,995 signal articles · 492 in last 24h · 103,318 total before filter · latest 1h ago
492last 24h
2476last 7d
479● bullish (7d)
251● bearish (7d)
197publishers
AllMacro242Earnings1457M&A138Regulatory16Product4Analyst29
✕ clear all filtersticker: INTCSentiment:bullishneutralbearish✓ showing all (incl. clickbait)
Is Intel (INTC) Fairly Valued Following Q2 Guidance And AI Partnership Updates?
Simply Wall St.17h agobullish
Is Intel (INTC) Fairly Valued Following Q2 Guidance And AI Partnership Updates?

Intel (INTC) heads into the Future of Memory and Storage 2026 conference in Santa Clara with investors weighing fresh Q2 results, updated revenue guidance, and new AI focused partnerships across PCs, packaging, and foundry services. See our latest analysis for Intel. Intel’s recent conference buzz, new AI PC and packaging collaborations, and stronger Q2 guidance sit against a mixed price pattern. The share price is up 10.92% over one day and 16.96% over seven days, yet down 16.13% over 30...

INTC Q2 Deep Dive: Data Center and AI Strength Offset Market Concerns Amid Supply Constraints
StockStory1d agoneutral
INTC Q2 Deep Dive: Data Center and AI Strength Offset Market Concerns Amid Supply Constraints

Computer processor maker Intel (NASDAQ:INTC) announced better-than-expected revenue in Q2 CY2026, with sales up 25.4% year on year to $16.13 billion. On top of that, next quarter’s revenue guidance ($16.3 billion at the midpoint) was surprisingly good and 7.8% above what analysts were expecting. Its non-GAAP profit of $0.42 per share was 93.1% above analysts’ consensus estimates.

Intel (INTC) Faces New AI And Packaging Pressure From China And TSMC
Simply Wall St.1d agoneutral
Intel (INTC) Faces New AI And Packaging Pressure From China And TSMC

Chinese tech groups are accelerating work on open-weight AI models, with Alibaba releasing a powerful new system that could increase competition with Intel in AI infrastructure. TSMC is reportedly developing advanced chip packaging technology that resembles Intel's EMIB approach, which could narrow Intel's edge in high performance chip designs. These developments add fresh competitive risks for Intel's AI and packaging plans that have not been the focus of recent coverage. Intel, trading on...

Is Intel’s AI PC and Advanced Packaging Ecosystem Shift Altering The Investment Case For Intel (INTC)?
Simply Wall St.1d agoneutral
Is Intel’s AI PC and Advanced Packaging Ecosystem Shift Altering The Investment Case For Intel (INTC)?

In late July 2026, mimik Technology announced a collaboration with Intel to optimize its mimOE Agentix Operating Engine for Intel-powered AI PCs, while Lens Technology signed a non-binding memorandum of understanding with Intel to explore glass-based TGV advanced packaging and other AI hardware opportunities. Together with fresh earnings showing higher sales but a larger net loss of US$11.03 billion, these moves highlight Intel’s push to link AI PCs, advanced packaging and foundry execution...