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The full-stack AI buildout mapped as 6 layers — silicon → systems → memory → optics → cloud → power. Bottleneck rank annotated where applicable: Memory is the #1 constraint today (HBM sold out through 2026), Networking/Optics is #2 (bandwidth demand exploding with inference), Power/Grid is #3 (multi-year structural). Capital rotates layer-by-layer as each bottleneck binds.
source: BD-investing-infographic-2026-05-02